产品与技术
软硬结合/软板

所带来的改变
软硬结合板及软板为将多个刚性电路板组件集成到单个电路板的需求中提供了可靠的解决方案。这些产品还可以减少电路板的整体重量和解决空间要求。
柔性印刷电路板是刚性电路和柔性电路优点的结合。该技术允许用户实现各种优势,如信号传输、稳定性和尺寸。我们是这类板材的领先生产商,拥有广泛的专业知识和产品经验。
我们的工程师能够为客户提供设计指导,并帮助他们找到满足其产品特定需求的最佳解决方案。通过我们在软硬结合板及软板设计领域的丰富经验,我们能够帮助他们提高整体产量并降低生产成本。与客户的密切合作使他们能够创建创新和可持续的解决方案,并帮助客户优化产品设计。

中富能做什么
为了应对对柔性印刷电路板日益增长的需求,我们还能够支持核心HDI技术与柔性印刷电路板相结合的批量生产。
技术特点
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工厂流程

技术参数
No. | ITEM | Capability | ||
---|---|---|---|---|
1 | Panel size | Double side | ENIG/ENEPIG | 410mm*510mm |
≥4 layers | ENIG/ENEPIG | 410mm*510mm | ||
2 | Stack up | Blind/Buried board | Pressing times | MAX≤3times |
铜厚能力 | Inner layer | 1/3OZ-2OZ MAX 2OZ |
||
Outer layer | 1/3OZ-2OZ | |||
Min Dielectric ThK | 0.006mm(电容材料) | |||
Max Layer count | 12L | |||
Final board ThK Tolerance | ThK≤1.0mm | ±0.03mm | ||
ThK>1.0mm | ±0.05mm | |||
3 | Line/Space | Inner Layer | 1/3OZ | 35um/35um |
1/2OZ | 40um/40um | |||
1OZ | 65um/65um | |||
2OZ | 6/5.5mil | |||
外层线宽/线距 | 1/3OZ | 35um/35um | ||
1/2OZ | 40um/40um | |||
1OZ | 65um/65um | |||
2OZ | 6/5.5mil | |||
Pad Tolerance | ≤12mil | ±20um | ||
>12mil | ±30um | |||
4 | Drill | Mechanical Drill size | 0.1-4.0mm | |
PTH Hole Tolerance | ±0.05mm | |||
NPTH Hole Tolerance | ±0.03mm | |||
Plated slot tolderance | Long slot | ±0.075mm | ||
Short Slot | ±0.1mm | |||
Aspect Ratio | 孔径=0.15mm | 7:1 | ||
孔径=0.2mm | 10:1 | |||
孔径 ≥0.25mm | 15:1 | |||
Back drill(Back drill/Depth-control drill) | Hole size | 0.4-6.35mm | ||
relative to through hole | 整体大0.2mm | |||
Back drill depth tolerance | ±0.1mm | |||
Stub length | 0.05-0.25 | |||
5 | Min BGA | 1.0mm BGA 2 trace | Yes | |
0.8mm BGA 1 trace | Yes | |||
0.65mm BGA | Yes | |||
0.5mm BGA | Yes | |||
0.4mm BGA | Yes | |||
6 | Laser | Laser hole size | 0.07-0.2mm | |
Save distance from laser hole to laser hole | 0.025mm | |||
Laser hole size | ≤1:1 | |||
7 | Soldermask | Color | Green,Yellow,Black,Blue,Red, White, Matt green | |
SM ThK | Single print thickness | 10-30um | ||
Double print thickness | 20-60um | |||
The line corner | ≥5um | |||
Min SM dam | normal color 3.0mil,other color min 4mil | |||
8 | Resin plugging | hole size | 0.1-0.6mm | |
PCB ThK | 0.15-3.0mm | |||
Resin plugging aspect ratio | 12:1 | |||
9 | Impedance | Capability of Impedance | Single line impedance<50Ω | ±3.5Ω |
Single line impedance≥50Ω | ±7% | |||
Differential line impedance | ±7% |

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