产品与技术
多高层印刷电路板
所带来的改变
由于多层印刷电路板行业的出现，此类型电路板的数量显著增加。它们通常用于各种电子设备，如电源控制系统、服务器、电动 车辆、医疗设备和5G基站。中富电路可以承接从小批量到大批量各种数量的生产。目前公司能生产的最大层数为34层。
中富电路是印刷电路板制造行业的先进供应商。我们为客户提供广泛的解决方案，其中一些客户是世界上最具创新性和竞争力的公司。 在广泛的PCB产品中，我们提供卓越的质量和极具竞争力的价格。通过我们的全球业务和先进的制造能力，我们能够为客户提供他们所 需要的安心服务。
与其他类型的印刷电路板（通常为单层结构）不同，常规的多层PCB一般具有高级技术要求同时可以为任意层数。通过我们多维的产品 经验及充足的生产经验，我们能够为客户提供完整的解决方案，支持他们在不同设计和新产品导入阶段的各种需求。我们的PCB专家团队 使我们能持续够跟上行业的尖端技术需求。
中富能做什么
二十多年来，中富电路一直致力于生产能源类PCB。针对厚铜类型产品，我们不仅可以生产铜厚高达12OZ的超厚箔。并且精通各种特殊 生产工艺，如金属半孔、埋盲孔设计和各种塞孔要求。
我们是平面变压器产品的领先制造商，产品广泛应用于智能手机、平板电脑和电脑等快速充电设备。通过广泛的生产能力和加工技术，能够 为客户提供高质量、高可靠性的产品和服务。
技术特点
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工厂流程
技术参数
| No. | ITEM | MP Capability | NPI Capability | ||
|---|---|---|---|---|---|
| 1 | Panel size | Double side | HASL | 544*800mm | 620*800mm |
| ENIG/Immersion Tin | 544*800mm | 620*1200mm | |||
| ≥4 layers | HASL | 544*650mm | 620*710mm | ||
| ENIG/Immersion Tin | 544*650mm | 620*710mm | |||
| 2 | 叠层 Stack up |
Blind/Buried board | Pressing times | MAX≤3times | MAX≤4times |
| 铜厚能力 | Inner layer | 1/2Oz-5Oz | 1/2Oz-12Oz | ||
| Outer layer | 1/2Oz-5Oz | 1/2Oz-12Oz | |||
| Min Dielectric ThK | 0.1mm | 0.043mm（≤3Oz） | |||
| Max Layer count | 20层 20L |
34层 34L |
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| Final board ThK Tolerance | ThK≤1.0mm | ±0.1mm | ±0.1mm | ||
| ThK＞1.0mm | ±10% | ±8% | |||
| 3 | Line/Space | Inner Layer | 1/2OZ | 4/4mil | 3/3mil |
| 1OZ | 5/5mil | 4/4mil | |||
| 2OZ | 7/7mil | 6/6mil | |||
| 3OZ | 8/8mil | 7/7mil | |||
| 4OZ | 10/10mil | 8/8mil | |||
| 5OZ | 12/12mil | 10/10mil | |||
| 外层线宽/线距 | 1/3OZ | 4/4mil | 3/3mil | ||
| 1/2OZ | 4/4mil | 4/4mil | |||
| 1OZ | 5/5mil | 4.5/4.5mil | |||
| 2OZ | 8/8mil | 7/7mil | |||
| 3OZ | 10/10mil | 8/8mil | |||
| 4OZ | 12/12mil | 10/10mil | |||
| 5OZ | 14/14mil | 12/12mil | |||
| Pad Tolerance | ≤12mil | ±1.2mil | ±1.2mil | ||
| ＞12mil | ±10% | ±10% | |||
| 4 | Drill | Mechanical Drill size | 0.2-6.35mm | 0.1-6.35mm | |
| PTH Hole Tolerance | ±0.075mm | ±0.075mm | |||
| NPTH Hole Tolerance | ±0.05mm | ±0.05mm | |||
| Plated slot tolderance | Long slot | ±0.075mm | ±0.075mm | ||
| Short Slot | ±0.1mm | ±0.1mm | |||
| Aspect Ratio | 孔径=0.15mm | 12:1 | 12:1 | ||
| 孔径=0.2mm | 16:1 | 16:1 | |||
| 孔径 ≥0.25mm | 18:1 | 20:1 | |||
| Back drill(Back drill/Depth-control drill) | Hole size | 0.4-1.0mm | 0.4-6.35mm | ||
| Back drill relative to through hole | D+0.2mm | D+0.15mm | |||
| Back drill depth tolerance | ±0.1mm | ±0.08mm | |||
| Stub length | 0.05-0.25mm | 0.05-0.2mm | |||
| 最小孔壁到孔壁（不同网络） | 0.4mm | 0.3mm | |||
| 最小孔壁到孔壁（同一网络） | 0.25mm | 0.2mm | |||
| 5 | Min BGA | 1.0mm BGA 2 trace | Yes | Yes | |
| 0.8mm BGA 1 trace | Yes | Yes | |||
| 0.65mm BGA | Yes | Yes | |||
| 0.5mm BGA | Yes | Yes | |||
| 0.4mm BGA | NO | Yes | |||
| 6 | Laser | Laser hole size | 0.07-0.2mm | 0.07-0.225mm | |
| Save distance from laser hole to laser hole | 9mil | 7mil | |||
| Laser hole size | ≤0.8:1 | ≤1:1 | |||
| 7 | Soldermask | Color | Green,Yellow,Black,Blue,Red, White, Matt green | Green,Yellow,Black,Blue,Red, White, Matt green | |
| SM ThK | Single print thickness | 10-30um | 10-30um | ||
| Double print thickness | 20-60um | 20-60um | |||
| The line corner | ≥5um | ≥5um | |||
| Min SM dam | normal color 3.0mil，other color min 4mil | normal color 3.0mil，other color min 4mil | |||
| 8 | Resin plugging | hole size | 0.15-0.6mm | 0.15-0.6mm | |
| PCB ThK | 0.3-4.0mm | 0.3-4.5mm | |||
| Resin plugging aspect ratio | 12:1 | 12:1 | |||
| 9 | Impedance | Capability of Impedance | Single line impedance<50Ω | ±5Ω | ±3.5Ω |
| Single line impedance≥50Ω | ±10% | ±7% | |||
| Differential line impedance | ±10% | ±7% | |||
