Seq	Item		Technical Specification				Remarks
			Standard		Advanced
1	Number of Layer		18 Layers		32 Layers
2	Lamination type		FR4(Tg130-180), Halogen free lamination,Rogers,Teflon,Aluminum board,PI
3	Finish Board Thickness		0.3 mm ~ 6 mm
4	Copper Thickness		5oz		12oz
5	Aspect rate		8:1		12:1
6	Impedance	Single line	±10%		±8%
		Differential line	±10%		±8%
7	Hole to line(min) on Pressing	4L	5mil		4mil
		18L	10mil		8mil
		32L	12mil		10mil
8	Line width/space	Inner layer	3/3mil		2.5/2.5mil
		Outer layer	3/3mil		3/3mil
9	Hole size	Min drill bit	8mil		6mil
		Min Laser hole	4mil		4mil
10	Hole position tolerance		±3mil		±3mil
11	PTH hole diameter tolerance		±3mil		±2mil
12	NPTH hole diameter tolerance		±2mil		±1mil
13	Solder mask	Line to solder PAD	4mil		3mil
		Registration tolerance	±2mil		±1.5mil
14	Profile tolerance	Punching	±5mil
		Routing	±4mil		±2mil
15	E-Test	SMT pitch(min)	9mil		9mil
		BGA pitch(min)	18mil		18mil
16	Peelable mask thickness		5mil		5mil
17	Carbon ink thickness		0.3mil		0.3mil
18	Lead and lead free HASL thickness		SMD:40-2000u”
			GND:30-800u”
19	Immersion Au	Au thickness	1-5u”		1-5u”
		Ni thickness	80-200u”		80-200u”
20	Immersion tin thickness		0.8-1.2um		0.8-1.2um
21	OSP thickness		0.2-0.5um		0.1-0.6um
22	Immersion silver thickness		0.15-0.45um		0.15-0.45um