Seq	Item		Technical Specification				Remarks
			Standard		Advanced
1	Number of Layer		1-16 Layers		18-24 Layers
2	Base Material		CEM3, FR4		Teflon, Rogers, Aluminum Based
3	Finish Board Thickness		0.20 mm ~ 3.20 mm (8 mil ~ 126 mil)		0.13 mm ~ 4.5 mm (5 mil ~ 177 mil)
4	Minimum Core Thickness		0.1mm(4 mil)		0.08mm ( 3 mil)
5	Copper Thickness		Min. 1/2 OZ, Max. 4 OZ		Min. 1/4 OZ, Max. 6 OZ		Selective Area Available, Thicker Cu On Request
6	Min. Trace Wide& Line Space	Single Sided	0.100 mm ( 4 mil )		0.08mm ( 3 mil)
		Double Sided	0.100 mm ( 4 mil )		0.08mm ( 3 mil)
7	Min. Hole Diameter	Drilling /PTH	φ0.15 mm ( 6 mil )		φ0.10mm ( 4 mil)
		Punching	φ1.0 mm ( 40 mil )		φ0.90 mm ( 36 mil )		If Necessary
8	Dimension Tolerance	Hole Position	±0.08 ( 3 mil )		±0.05 ( 2 mil )
		Conductor Width(W)	±20% Deviation of Master A/W		±1mil Deviation of Master A/W
		Hole Diameter(H)	NPTH: ±0.05 mm ( 2 mil )		NPTH: ±0.03 mm ( 1 mil )
			PTH: ±0.075 mm ( 3 mil )		PTH: ±0.05 mm ( 2 mil )
		Outline Dimension	±0.13 mm ( 5 mil )		±0.10 mm ( 4 mil )
		Conductors & Outline  ( C - O )	±0.15 mm ( 6 mil )		±0.13 mm ( 5 mil )
		Warp and Twist	0.0075		0.005
9	Surface Treatment On Land Area		Immersion Gold, Flash Gold  and Hot Air Levelling		Leadfree HASL, Entek, Immersion Silver, Immersion Tin, Hard Gold
10	V-Cutting	Panel Size	457.2mm X 622 mm ( max. )		457.2mm X 1200 mm ( max. )
		Board Thickness	0.50 mm (20mil)  min.		0.30 mm (12mil)  min.
		Remain Thickness	1/3 board thickness		0.40 +/-0.10mm ( 16+/-4 mil )
		Tolerance	±0.13 mm(5mil)		±0.1 mm(4mil)
		Groove Width	0.50 mm (20mil)  max.		0.38 mm (15mil)  max.
		Groove to Groove	20 mm (787mil)  min.		10 mm (394mil)  min.
		Groove to Trace	0.45 mm(18mil)  min.		0.38 mm(15mil)  min.
11	Slot	Slot size tol.L≥2W	PTH Slot:  L：±0.13(5mil) W：±0.08(3mil)		PTH Slot:  L：±0.10(4mil) W：±0.05(2mil)		(1)L=Length of slot (2)W=Width of slot (3)Min.drill bit size for multi-hit is 0.60mm
			NPTH slot(mm)  L：±0.10(4mil) W：±0.05(2mil)		NPTH slot(mm)  L：±0.08(3mil) W：±0.05(2mil)
12	Min Spacing from hole edge to hole edge	0.30-1.60 (Hole Diameter)	0.15mm(6mil)		0.10mm(4mil)
		1.61-6.50 (Hole Diameter)	0.15mm(6mil)		0.13mm(5mil)
13	Minimum spacing between hole edge to circuitry pattern		PTH hole:    0.20mm(8mil)		PTH hole:    0.13mm(5mil)
			NPTH hole: 0.18mm(7mil)		NPTH hole: 0.10mm(4mil)
14	Image transfer Registration tol	Circuit pattern vs.index hole	±0.10(4mil)		±0.08(3mil)
		Circuit patten vs. 2nd drill hole	±0.15(6mil)		±0.10(4mil)
15	Registration tolerance of front/back image		0.075mm(3mil)		0.05mm(2mil)
16	Multilayers	Layer-layer misregistration	4layers:	0.15mm(6mil)max.	4layers:	0.10mm(4mil)max.
			6layers:	0.20mm(8mil)max.	6layers:	0.13mm(5mil)max.
			8layers:	0.25mm(10mil)max.	8layers:	0.15mm(6mil)max.
			8-22 Layers	0.30mm(12mil)max.	8-22 Layers	0.25mm(10mil)max.
		Min.Spacing From Hole Edge to  Innerlayer Pattern	0.225mm(9mil)		0.15mm(6mil)
		Min.Spacing From Outline to  Innerlayer Pattern	0.38mm(15mil)		0.225mm(9mil)
		Min. board thickness	4layers:0.30mm(12mil)		4layers:0.20mm(8mil)
			6layers:0.60mm(24mil)		6layers:0.50mm(20mil)
			8layers:0.8mm(32mil)		8layers:0.75mm(30mil)
		Board thickness tolerance	4layers:+/-0.13mm(5mil)		4layers:+/-0.10mm(4mil)
			6layers:+/-0.15mm(6mil)		6layers:+/-0.13mm(5mil)
			8-12 layers:+/-0.20mm(8mil)		8-12 layers:+/-0.15mm(6mil)
			14-24 layers: +/-0.25mm (10mil)		14-24 layers: +/-0.20mm (8mil)
17	Insulation Resistance		10KΩ~20MΩ(typical:5MΩ)
18	Conductivity		<50Ω(typical:25Ω)
19	Test voltage		250V
20	Impedance control		Typical: 50Ω+/-10%