| Seq | Item | Technical Specification | Remarks | ||||
| Standard | Advanced | ||||||
| 1 | Number of Layer | 18 Layers | 32 Layers | ||||
| 2 | Lamination type | FR4(Tg130-180), Halogen free lamination,Rogers,Teflon,Aluminum board,PI | |||||
| 3 | Finish Board Thickness | 0.3 mm ~ 6 mm | |||||
| 4 | Copper Thickness | 5oz | 12oz | ||||
| 5 | Aspect rate | 8:1 | 12:1 | ||||
| 6 | Impedance | Single line | ±10% | ±8% | |||
| Differential line | ±10% | ±8% | |||||
| 7 | Hole to line(min) on Pressing | 4L | 5mil | 4mil | |||
| 18L | 10mil | 8mil | |||||
| 32L | 12mil | 10mil | |||||
| 8 | Line width/space | Inner layer | 3/3mil | 2.5/2.5mil | |||
| Outer layer | 3/3mil | 3/3mil | |||||
| 9 | Hole size | Min drill bit | 8mil | 6mil | |||
| Min Laser hole | 4mil | 4mil | |||||
| 10 | Hole position tolerance | ±3mil | ±3mil | ||||
| 11 | PTH hole diameter tolerance | ±3mil | ±2mil | ||||
| 12 | NPTH hole diameter tolerance | ±2mil | ±1mil | ||||
| 13 | Solder mask | Line to solder PAD | 4mil | 3mil | |||
| Registration tolerance | ±2mil | ±1.5mil | |||||
| 14 | Profile tolerance | Punching | ±5mil | ||||
| Routing | ±4mil | ±2mil | |||||
| 15 | E-Test | SMT pitch(min) | 9mil | 9mil | |||
| BGA pitch(min) | 18mil | 18mil | |||||
| 16 | Peelable mask thickness | 5mil | 5mil | ||||
| 17 | Carbon ink thickness | 0.3mil | 0.3mil | ||||
| 18 | Lead and lead free HASL thickness | SMD:40-2000u” | |||||
| GND:30-800u” | |||||||
| 19 | Immersion Au | Au thickness | 1-5u” | 1-5u” | |||
| Ni thickness | 80-200u” | 80-200u” | |||||
| 20 | Immersion tin thickness | 0.8-1.2um | 0.8-1.2um | ||||
| 21 | OSP thickness | 0.2-0.5um | 0.1-0.6um | ||||
| 22 | Immersion silver thickness | 0.15-0.45um | 0.15-0.45um | ||||