| Seq | Item | Technical Specification | Remarks | ||||
| Standard | Advanced | ||||||
| 1 | Number of Layer | 1-16 Layers | 18-24 Layers | ||||
| 2 | Base Material | CEM3, FR4 | Teflon, Rogers, Aluminum Based | ||||
| 3 | Finish Board Thickness | 0.20 mm ~ 3.20 mm (8 mil ~ 126 mil) |
0.13 mm ~ 4.5 mm (5 mil ~ 177 mil) |
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| 4 | Minimum Core Thickness | 0.1mm(4 mil) | 0.08mm ( 3 mil) | ||||
| 5 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/4 OZ, Max. 6 OZ | Selective Area
Available, Thicker Cu On Request |
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| 6 | Min.
Trace Wide& Line Space |
Single Sided | 0.100 mm ( 4 mil ) | 0.08mm ( 3 mil) | |||
| Double Sided | 0.100 mm ( 4 mil ) | 0.08mm ( 3 mil) | |||||
| 7 | Min. Hole Diameter | Drilling /PTH | φ0.15 mm ( 6 mil ) | φ0.10mm ( 4 mil) | |||
| Punching | φ1.0 mm ( 40 mil ) | φ0.90 mm ( 36 mil ) | If Necessary | ||||
| 8 | Dimension Tolerance | Hole Position | ±0.08 ( 3 mil ) | ±0.05 ( 2 mil ) | |||
| Conductor Width(W) | ±20% Deviation of Master A/W | ±1mil Deviation of Master A/W | |||||
| Hole Diameter(H) | NPTH: ±0.05 mm ( 2 mil ) | NPTH: ±0.03 mm ( 1 mil ) | |||||
| PTH: ±0.075 mm ( 3 mil ) | PTH: ±0.05 mm ( 2 mil ) | ||||||
| Outline Dimension | ±0.13 mm ( 5 mil ) | ±0.10 mm ( 4 mil ) | |||||
| Conductors & Outline ( C - O ) | ±0.15 mm ( 6 mil ) | ±0.13 mm ( 5 mil ) | |||||
| Warp and Twist | 0.0075 | 0.005 | |||||
| 9 | Surface Treatment On Land Area | Immersion
Gold, Flash Gold and Hot Air Levelling |
Leadfree
HASL, Entek, Immersion Silver, Immersion Tin, Hard Gold |
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| 10 | V-Cutting | Panel Size | 457.2mm X 622 mm ( max. ) | 457.2mm X 1200 mm ( max. ) | |||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | |||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm ( 16+/-4 mil ) | |||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | |||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | |||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | |||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | |||||
| 11 | Slot | Slot size tol.L≥2W | PTH Slot: L:±0.13(5mil) W:±0.08(3mil) |
PTH
Slot: L:±0.10(4mil) W:±0.05(2mil) |
(1)L=Length
of slot (2)W=Width of slot (3)Min.drill bit size for multi-hit is 0.60mm |
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| NPTH slot(mm) L:±0.10(4mil) W:±0.05(2mil) |
NPTH
slot(mm) L:±0.08(3mil) W:±0.05(2mil) |
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| 12 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | |||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | |||||
| 13 | Minimum spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | ||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | ||||||
| 14 | Image transfer Registration tol | Circuit pattern vs.index hole | ±0.10(4mil) | ±0.08(3mil) | |||
| Circuit patten vs. 2nd drill hole | ±0.15(6mil) | ±0.10(4mil) | |||||
| 15 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | ||||
| 16 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil)max. | |
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil)max. | ||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil)max. | ||||
| 8-22 Layers | 0.30mm(12mil)max. | 8-22 Layers | 0.25mm(10mil)max. | ||||
| Min.Spacing
From Hole Edge to Innerlayer Pattern |
0.225mm(9mil) | 0.15mm(6mil) | |||||
| Min.Spacing From Outline to Innerlayer Pattern |
0.38mm(15mil) | 0.225mm(9mil) | |||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | |||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | ||||||
| 8layers:0.8mm(32mil) | 8layers:0.75mm(30mil) | ||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | |||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | ||||||
| 8-12 layers:+/-0.20mm(8mil) | 8-12 layers:+/-0.15mm(6mil) | ||||||
| 14-24 layers: +/-0.25mm (10mil) | 14-24 layers: +/-0.20mm (8mil) | ||||||
| 17 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | |||||
| 18 | Conductivity | <50Ω(typical:25Ω) | |||||
| 19 | Test voltage | 250V | |||||
| 20 | Impedance control | Typical: 50Ω+/-10% | |||||